description this series of bi-color chipleds is designed with the smallest footprint to achieve high density of components on board. they have the industry standard footprint of 1.6 mm x 0.8 mm and a height of only 0.5 mm. this makes them very suitable for cellular phone and mobile agilent hsmf-c16x high brightness miniature bi-color surface mount chipleds data sheet features ? small size ? 0603 industry standard footprint ? diffused optics ? operating temperature range of C30?c to +85?c ? compatible with reflow soldering ? available in various color combination ? available in 8 mm tape on 7" (178 mm) diameter reels applications ? keypad backlighting ? symbol indicator ? lcd backlighting ? pushbutton backlighting ? front panel indicator caution : hsmf-c163, HSMF-C164, hsmf-c168, and hsmf-c169 leds are class 1 esd sensitive. please observe appropriate precautions during handling and processing. refer to agilent technolo- gies application note an-1142 for additional details. equipment backlighting and indication. they are available in a wide range of color combinations. in order to facilitate automated pick and place operation, these chipleds are shipped in tape and reel, with 4000 units per reel. these parts are compatible with ir soldering. device selection guide part number color parts per reel hsmf-c162 alingap red/alingap amber 4000 hsmf-c163 alingap red/ingan green 4000 HSMF-C164 alingap red/ingan blue 4000 hsmf-c168 ingan green/ingan blue 4000 hsmf-c169 alingap amber/ingan blue 4000
2 package dimensions 1.6
(0.063? 0.16 (0.006) 0.5 (0.020) 0.4
(0.016) led dies diffused epoxy pc board soldering
terminals 0.8 (0.031) cathode line 0.3 (0.012) cathode line 1 2 3 4
polarity 1 3 hsmf-c162 amber 2 4 red hsmf-c163 green red HSMF-C164 blue red hsmf-c168 blue green hsmf-c169 blue amber notes:
1. all dimensions in millimeters (inches).
2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified.
3 electrical characteristics at t a = 25?c reverse breakdown capacitance thermal forward voltage v r (volts) c (pf), @ v f = 0, resistance v f (volts) @ i f @ i r = 100 m a f = 1 mhz r q j-pin (?c/w) color typ. max. min. typ. typ. alingap red 20 ma 1.9 2.4 5 15 300 alingap amber 20 ma 1.9 2.4 5 11 300 alingap red 10 ma 1.8 2.3 5 15 300 alingap amber 10 ma 1.8 2.3 5 11 300 ingan green 10 ma 3.4 3.8 5 35 500 ingan blue 10 ma 3.4 3.8 5 35 500 absolute maximum ratings for each die at t a = 25?c parameter alingap ingan units dc forward current [1] 20 10 ma power dissipation 50 38 mw reverse voltage 5 5 v led junction temperature 95 95 ?c operating temperature range C30 to +85 ?c storage temperature range C40 to +85 ?c soldering temperature see reflow soldering profile (figure 6) note: 1. derate linearly as shown in figure 4. optical characteristics at t a = 25?c color peak dominant luminous luminous intensity wavelength wavelength viewing angle efficacy i v (mcd) @ i f [1] l peak (nm) l d [2] (nm) 2 q 1/2 degrees [3] h v (lm/w) color min. typ. typ. typ. typ. typ. alingap red 20 ma 25 90 637 626 120 155 alingap amber 20 ma 25 90 595 592 120 480 alingap red 10 ma 10 35 637 626 120 155 alingap amber 10 ma 10 35 595 592 120 480 ingan green 10 ma 16 45 523 525 120 500 ingan blue 10 ma 2.5 10 468 470 120 80 notes: 1. the luminous intensity i v is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. the dominant wavelength l d is derived from the cie chromatically diagram and represents the perceived color of the device. 3. q 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. v f tolerance: 0.1 v.
4 intensity (i v ) bin limits [1] intensity @ 20 ma (mcd) bin id min. max. a 0.11 0.18 b 0.18 0.29 c 0.29 0.45 d 0.45 0.72 e 0.72 1.10 f 1.10 1.80 g 1.80 2.80 h 2.80 4.50 j 4.50 7.20 k 7.20 11.20 l 11.20 18.00 m 18.00 28.50 n 28.50 45.00 p 45.00 71.50 q 71.50 112.50 r 112.50 180.00 s 180.00 285.00 t 285.00 450.00 u 450.00 715.00 v 715.00 1125.00 w 1125.00 1800.00 x 1800.00 2850.00 y 2850.00 4500.00 tolerance: 15%. green color bins [1] dom. wavelength (nm) bin id min. max. a 561.5 564.5 b 564.5 567.5 c 567.5 570.5 d 570.5 573.5 e 573.5 576.5 tolerance: 0.5 nm blue color bins [1] dom. wavelength (nm) bin id min. max. a 460.0 465.0 b 465.0 470.0 c 470.0 475.0 d 475.0 480.0 tolerance: 1 nm orange color bins [1] dom. wavelength (nm) bin id min. max. a 597.0 600.0 b 600.0 603.0 c 603.0 606.0 d 606.0 609.0 e 609.0 612.0 f 612.0 615.0 tolerance: 1 nm color bin limits [1] yellow/amber color bins [1] dom. wavelength (nm) bin id min. max. a 582.0 584.5 b 584.5 587.0 c 587.0 589.5 d 589.5 592.0 e 592.0 594.5 f 594.5 597.0 tolerance: 0.5 nm ingan green color bins [1] dom. wavelength (nm) bin id min. max. a 515.0 520.0 b 520.0 525.0 c 525.0 530.0 d 530.0 535.0 tolerance: 1 nm note: 1. bin categories are established for classifi- cation of products. products may not be available in all categories. please contact your agilent representative for information on currently available bins. note: 1. bin categories are established for classifi- cation of products. products may not be available in all categories. please contact your agilent representative for information on currently available bins.
5 figure 2. forward current vs. forward voltage. figure 1. relative intensity vs. wavelength. figure 3. luminous intensity vs. forward current. 400 100 0 600 700 20 relative intensity ?% wavelength ?nm 500 60 40 80 450 550 650 10 50 30 70 90 ingan
blue ingan
green as
amber as
red as
orange 100 10 1 0.1 1.5 2.5 3.5 4.0 v f ?forward voltage ?v i f ?forward current ?ma 3.0 2.0 ingan as alingap 05 15 i f ?forward current ?ma 0 0.4 1.4 luminous intensity
(normalized at 20 ma) 30 0.8 0.2 1.0 10 0.6 1.2 as alingap 20 25 04 12 i f ?forward current ?ma 0 0.4 1.4 1.6 luminous intensity
(normalized at 10 ma) 16 0.8 0.2 1.0 8 0.6 1.2 2 6 10 14 ingan
6 figure 4. maximum forward current vs. ambient temperature. figure 5. relative intensity vs. angle. figure 6. recommended reflow soldering profile. figure 7. recommended soldering pad pattern. relative intensity ?% 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2030507090 -90 -20 -80 -60 -40 -10 10 40 60 80 230? max. 10 sec. max. 4?/sec.
max. over 2 min. time temperature 4?/sec. max. 140-160? ??/sec.
max. 0.70
(0.028) 0.70
(0.028) 0.30
(0.012) 0.40
(0.016) 0.60
(0.024) 0.40
(0.016) 0 25 0 20 60 80 100 5 i f max. ?maximum forward current ?ma t a ?ambient temperature ?? 40 15 20 10 10 30 50 70 90 ingan alingap
7 figure 8. reeling orientation. figure 9. reel dimensions. x x x x x x x x x x x x x x x x x x x x cathode side printed label user feed direction x x x x x 10.50 ?1.0 (0.413 ?0.039) 59.60 ?1.00
(2.346 ?0.039) 20.20 min.
( 0.795 min.) 6 ps 178.40 ?1.00
(7.024 ?0.039) 3.0 ?0.5
(0.118 ?0.020) 4.0 ?0.5
(0.157 ?0.020) 5.0 ?0.5
(0.197 ?0.020) 13.1 ?0.5
( 0.516 ?0.020) 8.0 ?1.0 (0.315 ?0.039) note:
1. all dimensions in millimeters (inches).
figure 10. tape dimensions. figure 11. tape leader and trailer dimensions. 8.00 ?0.30
(0.315 ?0.012) user feed
direction dim. a
(see table 1) 3.50 ?0.05
(0.138 ?0.002) 1.75 (0.069) dim. c
(see table 1) 0.20 ?0.05
(0.008 ?0.002) carrier tape cover tape dim. b
(see table 1) 4.00 (0.157) 2.00 ?0.05
(0.079 ?0.002) 4.00 (0.157) 1.50 (0.059) table 1
dimensions in millimeters (inches) cathode dim. a
?0.10 (?0.004) dim. b
?0.10 (?0.004) part number dim. c
?0.10 (?0.004) hsmf-c16x series 1.80 (0.071) 0.95 (0.037) 0.60 (0.024) end start there shall be a
minimum of 160 mm
(6.3 inch) of empty
component pockets
sealed with cover
tape. mounted with
components. there shall be a
minimum of 160 mm
(6.3 inch) of empty
component pockets
sealed with cover
tape. minimum of
230 mm
(9.05 inch)
may consist
of carrier
and/or
cover tape. notes:
1. all dimensions in millimeters (inches).
2. tolerance is ?0.1 mm (?0.004 in.) unless otherwise specified. 8
www.agilent.com/semiconduc- tors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (408) 654-8675 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (+65) 271 2451 india, australia, new zealand: (+65) 271 2394 japan: (+81 3) 3335-8152(domestic/ international), or 0120-61-1280(domestic only) korea: (+65) 271 2194 malaysia, singapore: (+65) 271 2054 taiwan: (+65) 271 2654 data subject to change. copyright ? 2002 agilent technologies, inc. obsoletes 5988-4546en february 5, 2002 5988-5606en reflow soldering for more information on reflow soldering, refer to application note 1060, surface mounting smt led indicator components . storage condition: 5 to 30?c @ 60% rh max. baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week baking recommended condition: 60 5?c for 20 hours.
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